The value of chip-package codesign is well established. Complex parts with high-speed signals put more constraints on the design of both IC and package, and careful design is required to achieve ...
Fullerton, Calif. — Designed for the termination of high-speed applications, TT electronics BI Technologies Electronic Components Division's RoHS-compliant SCSI termination resistor network is aimed ...
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LG Innotek’s ‘Dream Factory’ revolutionizes chip substrate production with AI, robotics
LG Innotek’s “Dream Factory” in Gumi, North Gyeongsang Province, was in full operation on April 17, producing flip-chip ball grid arrays (FC-BGA), next-generation semiconductor substrates. These ...
BANGALORE, India, Dec. 17, 2025 /PRNewswire/ --Semiconductor Advanced Substrate Market Size The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is ...
Ironwood Electronics’ Giga-snaP BGA socket adapter pair allows 0.5-mm-pitch, 11.5- by 13-mm, 14x14 array e-MMC modules housed in 153-ball BGAs to be socketed and subsequently operated without ...
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