SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today announced that it has developed the industry's first and highest-capacity ...
Nanya Technology Corp (南亞科技) yesterday said the DRAM supply crunch could extend through 2028, as the artificial intelligence (AI) boom has led the world’s major memory makers to dramatically reduce ...
BOISE, Idaho, Oct. 22, 2025 (GLOBE NEWSWIRE) -- In an era of unprecedented AI innovation and growth, the entire data center ecosystem is transforming toward more energy-efficient infrastructure to ...
Automotive industry analysts are forecasting another microchip shortage in the coming months, which could increase risks for production halts as costs skyrocket.
AI demand is triggering a historic memory-chip shortage. Meeting exponential demand for chips will be expensive and maybe even impossible.
TL;DR: SK hynix plans to increase DRAM production capacity by over 8x by 2026 to address global shortages and rising prices driven by demand from AI servers, GPUs, and CSPs. This expansion focuses on ...
TL;DR: DRAM suppliers like Samsung, SK hynix, and Micron control chip allocation amid tight production capacity, driven by surging AI demand for HBM memory. This has caused widespread shortages and ...
BOISE, Idaho, Nov. 09, 2023 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today demonstrated its industry leadership by announcing its 32Gb monolithic die-based 128GB DDR5 RDIMM memory ...
Rumors have risen that SK Hynix is accelerating the expansion of its 10nm-class sixth-generation 1c DRAM capacity. Previously, to concentrate on producing high-bandwidth memory (HBM), SK Hynix had ...
DRAM supply-demand tightness and rapid AI-driven demand expansion will drive contract prices up and prompt sustained capacity investment, Nanya Technology (NTC) president Pei-Ing Lee said, forecasting ...
CFO Brice Hill said demand signals tied to artificial intelligence-driven semiconductor investment remain “extremely strong,” with leading-edge logic, DRAM, and advanced packaging currently ...
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