A new plasma chemistry breakthrough could help manufacturers build the next generation of smaller, faster, and more powerful ...

Inside computer chips are billions of tiny transistors made from silicon. But the material is approaching its limits. In an effort to build smaller, more capable devices, researchers are exploring how ...

A Korean research team has developed a technology that enables the stable stacking of more than 10 ultrathin semiconductor ...

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

IBM's latest chip packs in twice as many transistors as the current state-of-the-art chip by adding a second layer of silicon ...

In recent years, computer chip performance has bumped up against the physical limitations of the space available on integrated circuits.

As artificial intelligence platforms like OpenAI's ChatGPT and Microsoft's Copilot go mainstream, power bills from their usage are exploding. In response, researchers are racing to build hardware that ...

IBM's NanoStack architecture has led to transistors that deliver 50% better performance and 70% less energy versus today's best technologies.

The big picture: Apple's latest manufacturing push is focused not on finished devices, but on the engineering layers that underpin them. In the desert north of Phoenix, at silicon fabrication plants ...