According to industry sources, TSMC is planning to introduce a 12 nanometer half-node process to enhance competition with 28nm and lower process nodes that have been adopted over the past few years.

Imec, headquartered in Leuven, Belgium, has successfully demonstrated the first III-V compound semiconductor FinFET devices integrated epitaxially on 300 mm silicon wafers, through a unique silicon ...

A while ago the dark satanic rumour mill suggested that Taiwan Semiconductor Manufacturing Company was planning to release a sexed-up version of its 16nm manufacturing technology dubbed “12nm”. At the ...

TSMC 3nm process node is the best FinFET technology and TSMC dominates semiconductor chip fabrication with higher transistor density, better yields on a mature technology and broad adoption by clients ...

TSMC held its North America Technology Symposium on Wednesday, April 23, 2025 at the Santa Clara Convention Center and presented update information on its relentless march to ever finer geometries and ...

LAWRENCEVILLE, Ga.--(BUSINESS WIRE)--Silicon Creations, a leading provider of precision IP for advanced SoC design, today announced its 1000th production FinFET tapeout at TSMC, alongside the ...