The phenomenon of packing densification under mechanical vibration involves utilising controlled vibratory motions to rearrange particles into denser configurations. This process is critical both for ...

Wide bandgap (WBG) semiconductor technologies have created new challenges and opportunities for power packages. Developments such as silicon carbide (SiC) and gallium nitride (GaN), have a higher ...

Various techniques for embedding 3D packaging to boost power density. Different methods for cooling chips using 3D packaging. New and emerging technologies for 3D packaging are being deployed at the ...

Imagine placing oranges or tennis balls into a rigid container. How can the balls be arranged such that they occupy the largest volume fraction of the container, otherwise known as the largest packing ...

The void fraction, an important powder packing property, directly impacts many of the powder's physical characteristics and applications. To demonstrate how the variation in powder particle size ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...