One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...

For high frequency applications, Barry Industries' hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity are available in six sizes – 3, 4, 5 ...

SAN DIEGO--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital ...

Dublin, July 29, 2025 (GLOBE NEWSWIRE) -- The "eFuse Market by Type, Packaging Type, Application, Vertical, and Region - Global Forecast to 2030" has been added to ResearchAndMarkets.com's offering.

New York, March 23, 2023 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Global Quad-Flat-No-Lead Packaging Market Size, Share & Industry Trends Analysis Report By Moulding ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

Housed in a 3 x 3 mm QFN package with ESD protection on all pins, the RF2861 single-band, front-end receiver also integrates a TX LO buffer amplifier. Designed for CDMA, JCDMA and CDMA450 applications ...

Housed in a 6-pin QFN package, the AD8312 RF power detector measures signals at operating frequencies from 50 MHz to 2.7 GHz. Features include a dynamic range of 45 dB, a temperature range from –40° ...

SANTEE, Calif.--(BUSINESS WIRE)--StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital ...