Samsung's new HBM4 memory samples sent to NVIDIA have reportedly passed their tests, with mass production now imminent to fight SK hynix and Micron.

Samsung Electronics could be ready to turn its semiconductor business around: HBM4 could arrive earlier, up to 3-6 months ...

Driven by the booming demand for artificial intelligence (AI) servers, high-bandwidth memory (HBM) has become a key factor ...

The AI chip market is expected to stay under Nvidia's dominance in 2026, as Samsung Electronics, SK Hynix, and Micron battle ...

Micron HBM4 features a 2048-bit interface, achieving speeds greater than 2.0 TB/s per memory stack and more than 60% better performance over the previous generation.1 This expanded interface ...

The company anticipates gradual growth throughout 2025, supported by the transition to HBM4, Foundry and Logic customer qualifications, and increasing demand across advanced packaging markets.

HBM4 will specify 24 Gb and 32 Gb layers, with options for supporting 4-high, 8-high, 12-high and 16-high TSV stacks. The committee has initial agreement on speeds bins up to 6.4 Gbps with ...

Samsung might beat its rivals to the punch in this high-stakes battle, as a new report says it's ready to begin the final phase of HBM4 development before moving to initial production in early 2025.

SEOUL, March 19 (Yonhap) -- SK hynix Inc. said Wednesday it has shipped samples of the next-generation high bandwidth memory (HBM), 12-layer HBM4, to its major customers for the first time in the ...

The HBM4 Controller supports the JEDEC Spec of 6.4 Gigabits per second (Gbps). The Controller is further capable of supporting operation up to 10 Gbps providing a throughput of 2.56 Terabytes per ...

New DRAM standard aims to solve a critical bottleneck.