Samsung Electronics could be ready to turn its semiconductor business around: HBM4 could arrive earlier, up to 3-6 months ...

Samsung's new HBM4 memory samples sent to NVIDIA have reportedly passed their tests, with mass production now imminent to fight SK hynix and Micron.

New DRAM standard aims to solve a critical bottleneck.

Micron Technology, Inc. (NASDAQ:MU) is one of the Must-Watch AI Stocks on Wall Street. On August 13, Wells Fargo expressed ...

SK hynix's foothold with HBM4 means its market share is about to grow. The firm is now considered NVIDIA’s top-tier memory partner, a status likely to bring in the lion’s share of orders.

Driven by the booming demand for artificial intelligence (AI) servers, high-bandwidth memory (HBM) has become a key factor ...

HBM4 will specify 24 Gb and 32 Gb layers, with options for supporting 4-high, 8-high, 12-high and 16-high TSV stacks. The committee has initial agreement on speeds bins up to 6.4 Gbps with ...

A single memory failure in a hyperscale AI cluster can cascade into hours of lost compute time.

Samsung might beat its rivals to the punch in this high-stakes battle, as a new report says it's ready to begin the final phase of HBM4 development before moving to initial production in early 2025.

The company anticipates gradual growth throughout 2025, supported by the transition to HBM4, Foundry and Logic customer qualifications, and increasing demand across advanced packaging markets.

Micron Technology announces shipment of HBM4 samples to multiple customers for next-gen AI platforms, featuring 2048-bit interface and 60% better performance. Plans to ramp up production in 2026.

The HBM4 Controller supports the JEDEC Spec of 6.4 Gigabits per second (Gbps). The Controller is further capable of supporting operation up to 10 Gbps providing a throughput of 2.56 Terabytes per ...